tomzbj 发表于 2010-7-14 15:32:25

MSP430居然要出DIP封装的了

http://focus.ti.com.cn/cn/docs/prod/folders/print/msp430g2231.html?DCMP=launch
pad&HQS=Other+EM+launchpad_g2231_em_pf#pricingpackaging

$0.7/ku,其他封装的还要便宜, 这个价位很有竞争力啊

先申个样片玩玩~

uaouu 发表于 2010-7-15 11:34:05

早就有DIP的了,我申请过f2002的,14脚DIP,0.65$

ckvlhf 发表于 2010-7-15 14:20:40

天啊!2系列早就有DIP的了呢!!!

chenhuwyl 发表于 2010-7-18 13:27:04

shibushio
页: [1]
查看完整版本: MSP430居然要出DIP封装的了