DraganfHimem X6
http://www.draganfly.com/uav-helicopter/draganfHimem-x6/http://cache.amobbs.com/bbs_upload782111/files_13/ourdev_428088.jpg
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http://cache.amobbs.com/bbs_upload782111/files_13/ourdev_428093.jpg
(原文件名:DF-X6_69.jpg) 郁闷，刚想到折叠形的和立体形的，就有人做出来了。
中国人（体制）没这么厉害吧能做出来，一看又是老外
这下有了明确的目标好往前赶了 http://www.draganfly.com/images/tech/DF-X6/x6-techspecs-hero2.jpg
http://www.draganfly.com/images/tech/DF-X6/x6-helicopter-tech-specs-measuring-diagram2.gif
RF Communications
2.4GHz Data Link
Link Type: Helicopter to Ground & Ground to Helicopter (Two-Way)
Helicopter Antenna: Wired Whip Antenna
Controller Antenna: Omni-Directional
RF Data Rate: 250kbps
Receiver sensitivity: -100dBm
Transmission Technique: DSSS (Direct Sequence Spread Spectrum)
Frequency band: 2.4000 - 2.4835 GHz
Certifications: CE, FCC, IC, ETSI
Data Link Channel Selection: Automatic (13 Channels)
5.8GHz Video Link
Link Type: Helicopter to Ground (One-Way)
Transmitter Antenna: Omni-Directional
Receiver Antennas: Omni-Directional & Flat Patch
Transmission Power: 12dBm
Transmitter Power Consumption: 500mW
NTSC and PAL Compatible
7 Selectable Channels: 5740MHz, 5760MHz, 5780MHz, 5800MHz, 5820MHz, 5840MHz, 5860MHz
11 Onboard Sensors
3 Solid State MEMS (Micro-Electro-Mechanical Systems) Gyros
3 Solid State MEMS (Micro-Electro-Mechanical Systems) Accelerometers
3 Magnetometers (Magnetoresistive Sensors)
1 Barometric Pressure Sensor
1 GPS Receiver
GPS Battery Backup: 75mAh Lithium Polymer
GPS
GPS Used For: Position Hold, Location & Velocity Data
Maximum Satellites Tracked Simultaneously: 16
Position Update Rate: 4 Hz
GPS Antenna: Ceramic Patch
Battery Backup: Lithium Polymer
Black Box Data Recorder
Flight Data Recording: On-Board
Stored To: Removable 1Gb MicroSD Memory Card
Data Recorded: Onboard Sensor Flight Data (Link quality, Orientation, Altitude, Speed, Direction)
http://www.draganfly.com/images/tech/DF-X6/x6-helicopter-black-box-flight-recorder3.jpg
Weight & Payload
Helicopter Weight: 1,000g (35oz)
Payload Capability: 500g (18oz)
Maximum Gross Take-Off Weight: 1,500g (53oz)
Flight Characteristics:
Climb Rate: 7m/s (23ft/s)
Descent Rate: 4m/s (13ft/s)
Turn Rate: 90°/second
Cruise Speed: 10km/h (6mph)
Maximum Speed: 50km/h (30mph)
Minimum Speed: 0km/h (0mph)
Launch Type: VTOL (Vertical Take Off and Landing)
Maximum Altitude ASL: 2,438m (8,000ft)
Maximum Flight Time: around 20 min (without payload)
Sound at 1m (3.28ft): 65dB
Sound at 3m (9.84ft): 60dB
Rotor Blades
Three Counter-Rotating Pairs (Six Rotors Total)
Rotor Blade Material: Molded Carbon Fiber
Upper Rotor Diameter: 40cm (16in)
Lower Rotor Diameter: 38cm (15in)
Upper Rotor Weight: 12g (0.42oz)
Lower Rotor Weight: 11g (0.38oz
Electric Motors
Brushless Motors: 6
Configuration: Direct Drive (One Motor per Rotor)
Safety Features: Stall Protection
Ball Bearing: 2 per Motor
Rotor Mounting Points: Integrated
Nominal Current Draw Per Motor: 1.04 Amps
Nominal Power / Motor: 15.4 Watts
Nominal Total Helicopter Motor Power: 92.4 Watts
Peak Total Helicopter Motor Power: 450 Watts
Motor Speed at Hover: 2000 RPM
Voltage: 14.8V
Weight: 38g (1.34oz)
Rechargeable Helicopter Battery
Cell Chemistry: Lithium Polymer
Voltage: 14.8V
Capacity: 2700mAh
Cell Configuration 4s2p (4-series 2-parallel)
Max Discharge: 20C Cont. / 40C Burst
Max Current: 54A Cont. / 108A Burst
Length: 7.0cm (2.8in)
Width: 6.7cm (2.6in)
Height: 2.7cm (1.0in)
Weight: 260g (9.2oz)
Connectors: Integrated Balance and Power
Recharge Time: 30 minutes (after typical flight)
Materials
Carbon Fiber
Glass Filled Injected Nylon
Aluminum & Stainless Steel Fasteners
RoHS Compliant
Operating Requirements
Recommended Pre-Use Temperature: 10° to 35°C (50° to 95°F)
Maximum Environmental Operating Temperature: -25° to 38°C (-13° to 100°F)
Relative Humidity: 0% to 90% Noncondensing
Maximum Windspeed: 30km/h (18mph) JN5139 Wireless Modules (IEEE802.15.4 and ZigBee)
JN5139-xxx-M02/04
up to4km range
M02 has SMA connector
M04 has uFl connector
Receiver sensitivity -100dBm
TX power +19dBm
TX current 125mA
RX current 45mA
18x41mm
http://www.jennic.com/products/modules/jn5139_modules 中国人可以做到的！！只是我们没下功夫在这上而已。只要有结构工程师、PCB layout工程师、DSP/逻辑工程师、嵌入式软件工程师、工艺工程师就可以做了。我们都是单打独斗，如果按项目来做，把系统分解了给各部分高手，这些很容易的。我是做硬件和逻辑的。 高…… 厉害 啊 下一步我也想做这个呢，这个看起来很不错。
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